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Kinetic Modeling of Intrinsic Stress in Thin Films: The Effects of Processing Parameters and Microstructure Evolution
Description:
Intrinsic stresses which develop during thin film deposition can degrade film performance and lead to the failure of systems and devices which rely on thin …
Year:
2018
Contributor:
Engwall, Alison (creator)
Guduru, Pradeep (Reader)
Chason, Eric (Advisor)
Sheldon, Brian (Reader)
Brown University. Engineering: Materials Science Engineering (sponsor)
Genre:
theses
Subject:
Thin films
Thin film stress
Thin film microstructure
Electroplating
Physical vapor deposition (PVD)
Collection:
Engineering
Materials Science Engineering
Theses and Dissertations
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